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Dicing & Grinding Tapes - High Temperature and UV Release Tapes. Die, Substrate and Component Attach Materials Made-In-USA: Dicing For Wafer Dicing And Back Grinding Tapes And Grease-Adhesive For Wafer Thinning Applications AIT is the only manufacturer of dicing tapes that can withstand high temperature exposure.
3M . Industrial Abrasives . Whether you need to grind, blend, polish, sand, prep, cut, clean or repair surfaces, 3M is the source for surface conditioning, coated, bonded, and superabrasives for use in metal fabrication, precision castings, cylindrical grinding, furniture and custom wood, automotive manufacturing, maintenance and more.
Grinding Tapes Recording Company is an independent record label that documents Boston's indie folk music scene. Grinding Tapes releases are usually recognizable due to their unique jacket style, which usually consists of recycled cardboard screen printed with a single-color design.
b) the butt joint which is formed by two ends that abut each other and are joined by means of a narrow strip of (mostly fibre-reinforced) tape either on the front or the reverse side of the belt. Since there are additional variations within these two types of joint categories, the belt can be perfectly adjusted to the grinding task at hand.
ICROS™ Thin Grinding Tapes. The ICROS™ thin wafer backgrinding tape line features special anti-warpage properties that significantly flattens the wafer. This tape has a warpage of 2mm versus 26mm for conventional tape which reduces risk of wafer breakage during handling and transportation. In addition, the super clean adhesive is designed ...
The LINTEC Adwill series includes UV curable dicing tapes, high performance back grinding tapes, dicing die bonding tapes required for semiconductor packaging, and backside coating tapes. Adwill continues to make steady progress in the advancement of related equipment and unique systems.
Heat resistance back grinding tape can correspond to the secondary process of wafer backside. After the back-grinding process, the wafers with the heat resistance back grinding tape can be processed (wet etching, ashing, metalizing, exposure/processing and so on).
The Adwill E series of UV curable Back Grinding Tape prevents damage on wafer surface during back grinding and contamination caused by grinding fluid and/or debris. Adhesion of the tapes can be substantially decreased with UV irradiation, allowing easy peeling without stress on the wafer.
Wafer Back Grinding Tapes NON-SILICONE, NON-EVA BASED COMPRESSIBLE BACKGRINDING AND THINNING TEMPORARY BONDING ADHESIVE TAPES FOR BUMPED WAFERS AND SUBSTRATES WITH UP TO 250 MICRON BUMP HEIGHTS: The configuration of the temporary bonding adhesive tapes are engineered for high reliability for wafers and substrates with extensive bumped …